SMT Type 1.27mm Elevated Box Header
![SMT Type 1.27mm Elevated Box Header SMT Type 1.27mm Elevated Box Header](https://www.wayconn.com/wp-content/uploads/2020/04/BH127-2M07-1.jpg)
Product overview
BH127-XXX-MXXGX-07 is an SMT Type 1.27mm Elevated Box Header, raised vertical soldering mount, customized stacking height, Position numbers from 10P ~ 100P; Insulator height: 5.7mm;![SMT Type 1.27mm Elevated Box Header Drawing SMT Type 1.27mm Elevated Box Header Drawing](https://www.wayconn.com/wp-content/uploads/2020/04/BH127-2M07-Drawing.jpg)
Specifications
Material | |
Contact | Brass |
Insulator | Thermoplastic, UL 94V-0; Standard PA6T |
Plating | Gold plating over nickel |
Solder Ability | IR Reflow: (260°C for 5-10 SEC.); Wave Solder: 230°C for 5-10 SEC. |
Electrical Performance | |
Current Rating | 1.0 Amp |
Insulation Resistance | 800MΩ Min |
Dielectric Withstanding | 400V AC |
Contact Resistance | 2mMΩ MAX |
Environmental | |
Operating Temperature | -40°C ~ +105°C |
Category and Tags:
1.27mm Pitch Box Header